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High Tg FR4 PCB Board Layout Multi Layer PCB Finished with HASL or ENIG

Categories PCB Board Layout
Place of Origin: China
Brand Name: ZYX
Certification: UL, CE, RoHs, REACH, SGS
Model Number: ZYX
MOQ: 10 PCS
Price: Negotiate
Packaging Details: Plastic bag + bubble packaging
Delivery Time: 5-7 DAYS
Payment Terms: L/C,T/T, Paypal, West Union
Supply Ability: 1 Million PCS Per Month
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    High Tg FR4 PCB Board Layout Multi Layer PCB Finished with HASL or ENIG

    High Tg FR4 PCB Board Layout Multi Layer PCB Finished with HASL or ENIG


    Description:

    1. Best service with quick response is always provided for our customers.
    2. Certifications of ISO9001:2008,UL,CE,ROHS,REACH,HALOGEN-FREE is meet.
    3. Advanced production equipment imported from Japan and Germany,such as PCB Lamination Machine, CNC drilling machine,Auto-PTH line, AOI(Automatic Optic Inspection),Probe Flying Machine and so on.
    4. Quality guarantee and professional after-sale service.
    5. All kinds of surface finish is accepted,such as ENIG,OSP.Immersion Silver,Immersion Tin, Immersion Gold, Lead-free HASL,HAL.
    6. BGA,Blind&Buried Vias and Impedence Control is accepted.
    7. Gerber file needed.

    PRODUCT’S DETAILS

    Raw Material

    FR-4 (Tg 180 available)

    Layer Count

    2-Layer

    Board Thickness

    1.2mm

    Copper Thickness

    1.0oz

    Surface Finish

    HASL/ENIG

    Solder Mask

    GREEN/RED

    Silkscreen

    White

    Min. Trace Width/Spacing

    0.075/0.075mm

    Min. Hole Size

    0.25mm

    Hole Wall Copper Thickness

    ≥20μm

    Measurement

    300×400mm

    Packaging

    Inner: Vacuum-packed in soft plastic bales
    Outer: Cardboard Cartons with double straps

    Application

    Communication,automobile,cell,computer,medical

    Advantage

    Competitive Price,Fast Delivery,OEM&ODM,Free Samples,

    Special Requirements

    Buried And Blind Via, Impedance Control, Via Plug,
    BGA Soldering And Gold Finger Are Acceptable

    Certification

    UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE


    PRODUCTION CAPABILITY OF PCB

    Process Engineering

    Items

    Manufacturing Capability

    Laminate

    Thickness

    0.2~3.2mm

    Production Type

    Layer Count

    2L-16L

    Cut Lamination

    Max. Working Panel size

    1000×1200mm

    Inner Layer

    Internal Core Thickness

    0.1~2.0mm

    Internal width/spacing

    Min: 4/4mil

    Internal Copper Thickness

    1.0~3.0oz

    Dimension

    Board Thickness Tolerance

    ±10%

    Interlayer Alignment

    ±3mil

    Drilling

    Manufacture Panel Size

    Max: 650×560mm

    Drilling Diameter

    ≧0.25mm

    Hole Diameter Tolerance

    ±0.05mm

    Hole Position Tolerance

    ±0.076mm

    Min.Annular Ring

    0.05mm

    PTH+Panel Plating

    Hole Wall copper Thickness

    ≧20um

    Uniformity

    ≧90%

    Outer Layer

    Track Width

    Min: 0.08mm

    Track Spacing

    Min: 0.08mm

    Pattern Plating

    Finished Copper Thickness

    1oz~3oz

    EING/Flash Gold

    Nickel Thickness

    2.5um~5.0um

    Gold Thickness

    0.03~0.05um

    Solder Mask

    Thickness

    15~35um

    Solder Mask Bridge

    3mil

    Legend

    Line width/Line spacing

    6/6mil

    Gold Finger

    Nickel Thickness

    ≧120u〞

    Gold Thickness

    1~50u〞

    Hot Air Level

    Tin Thickness

    100~300u〞

    Routing

    Tolerance of Dimension

    ±0.1mm

    Slot Size

    Min:0.4mm

    Cutter Diameter

    0.8~2.4mm

    Punching

    Outline Tolerance

    ±0.1mm

    Slot Size

    Min:0.5mm

    V-CUT

    V-CUT Dimension

    Min:60mm

    Angle

    15°30°45°

    Remain Thickness Tolerance

    ±0.1mm

    Beveling

    Beveling Dimension

    30~300mm

    Test

    Testing Voltage

    250V

    Max.Dimension

    540×400mm

    Impedance Control

    Tolerance

    ±10%

    Aspect Ration

    12:1

    Laser Drilling Size

    4mil(0.1mm)


    Quality High Tg FR4 PCB Board Layout Multi Layer PCB Finished with HASL or ENIG for sale
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