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No Need Preheating Pink Thermal Phase Change Interface Material For Notebook 0.95 W/mK

Categories Phase Changing Materials
Brand Name: Ziitek
Model Number: TIC™808P
Certification: RoHs
Place of Origin: China
MOQ: 1000PCS
Price: negotiation
Supply Ability: 100000pcs/day
Delivery Time: 3-5days
Packaging Details: 1000pcs/bay
Product Name: Phase Changing Materials
Color: Pink
phase transition temperature: 50℃~60℃
Density: 2.2g/cc
Thickness: 0.127~0.25mmT
Thermal Conductivity: 0.95 W/mK
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    No Need Preheating Pink Thermal Phase Change Interface Material For Notebook 0.95 W/mK

    No Need Preheating Pink Thermal Phase Change Interface Material For Notebook


    The TIC™808P Series is low melting point thermal interface material. At 50℃, The TIC™808P Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™808P Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.


    The TIC™808P Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.


    Features:


    > 0.024℃-in² /W thermal resistance
    > Naturally tacky at room temperature, no adhesive required
    > No heat sink preheating required


    Applications:


    > High Frequency Microprocessors
    > Notebook and Desktop PCs
    > Computer Serves
    > Memory Modules
    > Cache Chips
    > IGBTs


    Typical Properties of TIC™808P Series
    Product Name
    TICTM808P
    Testing standards
    Color

    Pink

    Visual
    Composite Thickness
    0.008"
    (0.203mm)
     
    Thickness Tolerance
    ±0.0008"
    (±0.019mm)
     
    Density
    2.2g/cc
    Helium Pycnometer
    Work temperature
    -25℃~125℃
     
    phase transition temperature
    50℃~60℃
     
    Thermal conductivity
    0.95 W/mK
    ASTM D5470 (modified)
    Thermal lmpedance @ 50 psi(345 KPa)
    0.053℃-in²/W
    ASTM D5470 (modified)

    0.34℃-cm²/W
    Standard Thicknesses:

    0.003"(0.076mm) 0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm)
    Consult the factory alternate thickness.

    Standard Sizes:

    9" x 18"(228mm x 457mm) 9" x 400'(228mm x 121M)
    TIC™800 series are supplied with a white release paper and a bottom liner. TIC™800 series is available in kiss cut an extended pull tab liner or individual die cut shapes.

    Peressure Sensitive Adhesive:

    Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

    Reinforcement:

    No reinforcement is necessary.

    Ziitek Culture


    Quality :

    Do it right the first time, total quality control

    Effectiveness:

    Work precisely and thoroughly for effectiveness

    Service:

    Quick response, On time delivery and Excellent service

    Team work:

    Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

    Quality No Need Preheating Pink Thermal Phase Change Interface Material For Notebook 0.95 W/mK for sale
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