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0.5mm High Dielectric Strength 2.2 g/cc Thermally Adhesive Tape For Heatsink Cooling 0.9 W/mK

Categories Thermal Adhesive Tape
Brand Name: Ziitek
Model Number: TIA810
Certification: RoHs
Place of Origin: China
MOQ: 10SQM
Supply Ability: 1000SQM/Day
Delivery Time: 2-3Work day
Packaging Details: 10RL/bag
Thickness: 0.1mmT~0.5mmT
Adhesive Type: Acrylic Adhesive
Thermal Conductivity: 0.9 W/mK
Voltage Breakdown: > 5000 Vac
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    • Product Details
    • Company Profile

    0.5mm High Dielectric Strength 2.2 g/cc Thermally Adhesive Tape For Heatsink Cooling 0.9 W/mK

    The TIA™810 Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.


    Features


    Thermal Conductivity 0.9W/mK.
    High bond strength to a variety of surfaces
    Double sided pressure sensitive adhesive tape.
    High performance, thermally conductive acrylic adhesive
    allow for good conformability to irregular surfaces and good electrical isolation
    Easy Application
    Eliminates need for external hardware (screws, clips, etc.)
    Available with easy release tabs

    Applications


    Mount heat sink onto BGA graphic processor or drive processor.
    Mount heat spreader onto power converter PCB or onto motor control PCB
    Can be used instead of heat cure adhesive,screw mounting or clip mounting
    Heat sink onto BGA graphic processor
    Heat sink to computer processor
    Heat sink onto drive processor
    LED Power Supply
    LED Controller
    LED Lights
    LED Ceilinglamp
    Monitoring the Power Box
    AD-DC Power Adapters
    Rainproof LED Power Supply
    Waterproof LED Power Supply
    Piranha wroof and common lED module
    LED module for Channelletters
    SMD LED module
    LED Flesible strip, LED bar
    LED PanelLight

    Typical Properties of TIA™800 Series
    Product NameTIA™806TIA™808TIA™810TIA™812TIA™818Test Method
    ColorWhiteWhiteWhiteWhiteWhiteVisual
    Construction
    &Compostion
    Ceramic filled silicone elastomer***
    Composite Thickness0.006"/0.152mm0.008"/0.203mm0.010"/0.254mm0.012"/0.304mm0.018"/0.457mmASTM D751
    Specific Gravity2.2 g/ccASTM D297
    Specific Gravity1 l/g-KASTM C351
    Hardness50 Shore AASTM 2240
    Tensile Strength450 psi>600 psi>600 psi>600 psi>600 psiASTM D412
    Continuous Use Temp(-58 to 356℉) / (-50 to 180℃)***
    Electrical 
    Dielectric Breakdown Voltage>1500 VAC>3500 VAC>5000 VAC>5000 VAC>5000 VACASTM D149
    Dielectric Constant5.5 MHzASTM D150
    Volume Resistivity5.0X10" Ohm-meterASTM D257
    Flame Rating94 V0equivalent UL
    Thermal 
    Thermal Conductivity0.9 W/m-KASTM D5470
    Thermal lmpedance @50psi0.21℃-in²/W0.35℃-in²/W0.82℃-in²/W1.23℃-in²/W1.83℃-in²/WASTM D5471
    Standard Thicknesses:

    0.005"(0.127mm) 0.006"(0.152mm) 0.008"(0.203mm) 0.010"(0.254mm) 0.015"(0.381mm) 0.020"(0.508mm)
    Consult the factory alternate thickness.

    Standard Sizes:

    10" x 18"(254mm x 457mm) 10" x 400'(254mm x 121.9M)
    Individual die cut shapes can be supplied.

    Reinforcement:

    TIA™800 Series sheets are fiberglass reinforced.
    Quality 0.5mm High Dielectric Strength 2.2 g/cc Thermally Adhesive Tape  For Heatsink Cooling 0.9 W/mK for sale
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