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Ceramic / Glass UV Laser Cutting Machine Precise Control JG18 , Cutting Circuit Board

Categories Laser PCB Depaneling Machine
Brand Name: ASIDA
Model Number: JG18
Certification: CE
Place of Origin: China
MOQ: 1Set
Price: Negotiation
Payment Terms: T/T, L/C
Supply Ability: Negotiation
Delivery Time: 2Weeks
Packaging Details: Wooden Carton
Laser Power: 10W
Maximum Processing Size: 720mm×540 mm(21″×28″)
XY Platform Maximum Operating Speed: 50m/min
Positioning accuracy: ±3µm
Repeat accuracy: ±1µm
System Processing Precision: ±20µm
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    Ceramic / Glass UV Laser Cutting Machine Precise Control JG18 , Cutting Circuit Board


    Ceramic / Glass UV Laser Cutter Precise Control JG18 , Cutting Circuit Board


    Product Specifications / Features


    Product name

    UV Laser Cutting Machine

    Brand Name:

    ASIDA

    Model Number:

    JG18

    Certification:

    CE

    Place of Origin:

    China

    Packaging Details:

    Wooden Carton



    ASIDA-JG18 UV Laser cutting machine


    1. Usage of PCB UV Laser Cutting Machine JG18
    Precisive cutting of FPC and organic membrane covering board without molds or the protection plate. High-energy laser source and precise control of laser beams can improve the processing speed and the accuracy of processing results. It has all the functions same as the one produced by LPKF but price is lower.
    2. Characteristic of PCB UV Laser Cutting Machine JG18
    2.1. Independent intellectual property rights of the control software, Humanized interface, complete functions and simple operation.
    2.2. Processing any graphic, cutting different thickness and different materials, stratified processing and complete synchronously
    2.3. Adopt high-performance ultraviolet light laser with short wave length, high beam quality and higher peak power properties. Because ultraviolet light is through decomposition, vaporization instead of melting to cutting the materials, so almost no burrs after processing, small thermal effect, no stratification, precise cutting effects, smooth, steep sidewall.
    2.4. Fixed sample by using Vacuum mode, without matrix protection plate, convenient and improving the processing efficiency.
    2.5. Used for a variety of substrate materials cutting, such as: Silicon, ceramics, glass, etc.
    2.6. Automatic correction, automatic positioning and multi board cutting function. Automatic board thickness measurement and compensation. Full stroke motor compensation function. Improved cutting accuracy, reduced horizontal vibration. Improved depth cutting accuracy. Improved efficiency in cutting complex patterns.

    Quality Ceramic / Glass UV Laser Cutting Machine Precise Control JG18 , Cutting Circuit Board for sale
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