FPC PCB Punching Machine FR4 Substrate Cutting With Cutomized Die Tooling
Flexible PCB Board Cutting Machine FPC Punch With Cutomized Die Tooling Features: 1. Depaneling PCB/FPC by means of punching dies, to avoid micro-cracks caused by manual. 2. Die toolings is changeable 3. Easy set up of punching dies 4. Loading and ......
Winsmart Electronic Co.,Ltd
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FR4 Substrate Multilayer Printed Circuit Board , Circuit Board Fabrication
Shenzhen Printed circuit board FR4 Substrate Multilayer PCB Assembly Fabrication Product Despcription Item Specification Material FR4(Stand Tg, Middle TG, High TG, Halogen free),Rogers, High Frequency Layer 2-48 layers Board thickness 0.15-4.5mm Copper ......
Shenzhen Fany Technology Co.,Ltd
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FR4 Substrate Material Double Layer PCB Blue Solder Mask Ink
Double Layer FR4 Substrate Material PCB Blue Solder Mask Ink Main Features: 1 2 Layer FR4 substrate material printed circuit board. 2 ROHS, MSDS, SGS, UL, ISO9001&ISO14001 Certificated. 3 FR4 TG150 material, pcb thickness is 1.6mm. 4 Blue solder mask and ......
Witgain Technology Limited
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1.6mm FR4 Substrate Large Size Motor Control Rigid Flexible PCB
1.6mm Fr4 Substrate PCB Large Size Motor Control PCB Electric Circuit Board FASTPCBA is a one-stop comprehensive PCB manufacturing and assembly ......
Shenzhen Jingbang Technology Co. , Ltd
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FR4 Substrate ENIG Finish Custom PCB Board ENIG 3u'' For Socket
Custom PCB Board With ENIG Finish For Socket Application 1. Custom service PCB board. 2. 20um PTH wall. 3. ENIG 3u'' surface coating. 4.Socket application. 1 Layers 2 2 Material FR4 3 Board thick 1.55mm 4 Cu weight 1OZ 5 Min hole 0.13mm 6 Usage Socket 7 ......
Abis Circuits Co., Ltd.
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FR4 TG135 2 Layer PCB , ENIG 2u Surface 0.075mm PCB SMT Assembly
FR4 TG135 2-layer PCB ENIG 2u surface 0.075mm FR4 TG135 is a substrate material used in the manufacture of printed circuit boards (PCBs). Its glass transition temperature (Tg) of 135°C indicates that it can withstand moderate temperatures during operation without losing its mechanical or electrical properties. A 2-layer PCB made with FR4 TG135 material refers to a PCB with two layers of substrate......
ShenZhen Jieteng Circuit Co., Ltd.
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BT FR4 NAND Memory Substrate Board 35/35um 4 Layer ENEPIG
...substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate, Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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FR4 Printed Circuit Board Assembly 0.5mm Immersion Gold IATF16949 Certificate
...material in PCB processing for many years. This is mainly because, although FR4 substrates contain similar properties and are mostly epoxy resin systems, this range is wide. As a result, today's FR4 materials are commonly used in the most common terminals....
Shenzhen Sky-Win Technology Co., Ltd
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4" Sapphire Based GaN Templates Semiconductor Substrate
2inch 4inch 4" Sapphire based GaN templates GaN film on sapphire substrate Properties of GaN Chemical properties of GaN 1) At room temperature, GaN is insoluble in water, acid and alkali. 2)Dissolved in a hot alkaline solution at a very slow rate. 3) NaOH......
SHANGHAI FAMOUS TRADE CO.,LTD
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JDCD05-001-007 CVD Diamond Substrates
...Substrates Overview Diamond is a unique material that often exhibits extreme properties compared to other materials. Discovered about 30 years ago, the use of hydrogen in plasma-enhanced chemical vapor deposition (CVD) has enabled the growth and coating of diamond in film form on various substrate materials. Specification properties Synthetic diamond Density(g/cm3) 3.515 Intrinsic properties......
Shanghai GaNova Electronic Information Co., Ltd.
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